RESEARCH NEWS

Advanced-Substrates for-Chiplets and-Heterogeneous-Integrated-Packaging (4)
Seminar on “Advanced Substrates for Chiplets and Heterogeneous Integrated Packaging”
On July 14, Eastern International University (EIU) hosted a seminar titled “Advanced Substrates for Chiplets...
khoa-cit-eiu-chao-don-tan-sinh-vien-khoa-2025 (9)
Connect & Collaborate: Building the future for freshmen of the School of Computing and Information Technology
On September 9, the School of Computing and Information Technology at Eastern International University...
khep-lai-tf-scale-2025-eiu-va-sp (1)
Closing TF SCALE 2025: A journey of knowledge connection, creativity, and the spread of sustainable values
On October 1, 2025, Eastern International University (EIU) and Singapore Polytechnic (SP) held the closing...
ket-noi-voi-bosch-vietnam-eiu-mo-rong-co-hoi-hop-tac-trong-dao-tao-nghien-cuu (1)
Connecting with Bosch Vietnam: EIU Opens Up Opportunities for Collaboration in Training and Research
On October 22, Eastern International University (EIU) welcomed and held a working session with representatives...
dao-tao-ros-giang-vien-chuyen-vien-eiu (10)
ROS2 TRAINING: EIU ENHANCES STAFF EXPERTISE TOWARD INDUSTRY 4.0 STANDARDS
From July 28 to August 1, Eastern International University (EIU) in collaboration with the Advanced Remanufacturing...
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EIU UNIGAMES 2025 Closing Ceremony: Concluding a vibrant and memorable sports season
After nearly two vibrant weeks filled with thrilling matches and an electrifying atmosphere, the Eastern...
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